AZ® 40XT-11D Photoresist
AZ 40XT-11D is an advanced chemically amplified positive tone photoresist optimized for use in high aspect ratio plating, MEMs, and extreme RIE etch applications. AZ 40XT-11D is fast, MIF developer compatible and requires no post bake re-hydration delays. Film thicknesses from 20 to 120+µm are achievable. Develop in AZ 300MIF or 917MIF developer. Strips easily in AZ 400T Stripper.
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Typical Process
Soft Bake: 125C Expose: i-line or broadband PEB: 105C Develop: spray/puddle Developer: AZ 300MIF
60µm Cu stud post strip